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「Other Process」

「Wafer Backgrinding」

Diameter: 5 inch to 12 inch
Reacheable Thickness: as thin as 200um for 5 & 6 inch, as thin as 300um for 8 & 12 inch

「Wafer Size down」

We can arrange for resizing of wafers from 12, 8, 6 inch to 4 inch etc.

「Wafer Thining」

We can arrange Wafer thining process. If you need 200um or more thin wafers, please let us know.

「Squre Process」

We can make square wafers from 6, 8, 12 inch round wafers.

「Dicing Process」

Diameter: 2 inch to 12 inch
Processable Thickness: from under 100 um
Chip size: min. approx. 0.1 um square (Rectangle shapes are also available.)
* It is possible to cut out a mixture of several sizes from a wafer.

We can also provide dicing frames, grip rings, frost carriers etc.

* We can arrange for various processes not only for silicon but also for SiC, quartz, sapphire etc.

「Laser Marking」

We can arrange Laser Marking process for your wafers.

「RCA cleaning」

We can arrange wafer cleaning process only.

「Wafer Analysis」

We can arrange wafer analysis for your wafers.

「Grinding process」

	ITEM	PROCESSABLE SIZE	TOLERANCE
1	Ingot diameter	φ70mm-φ330mm	±0.05mm
2	Ingot length	MAX 600mm
3	Flat length	MAX 60mm	±2.00mm
4	Notch depth	MAX 3mm	±0.25mm
5	Notch length	MAX 340mm

	ITEM	PROCESSABLE SIZE	TOLERANCE
1	Grinding of cylinder	φ5-φ100mm×L50mm	±0.03mm
2	Polishing inside cylinder	φ5-φ50mm×L50mm	±0.03mm

Remark: Surfece Ra: SD#300 Ra0.37〜0.75(μm)

「Polishing ability」

	ITEM	PROCESSABLE SIZE	TOLERANCE
1	MAX size	Ｌ500mm×Ｄ300mm×Ｈ215mm	±0.03mm
2	MIN size	Ｌ 20mm×Ｄ　20mm×Ｈ 　2mm	±0.03mm

Remark： Surfece Ra: SD#300 Ra0.37〜0.75(μm) SD#500 Ra0.09〜0.17(μm)

「Hole & special shape」

	ITEM	PROCESSABLE SIZE	TOLERANCE
1	Hole size	φ0.5mm-φ4.0mm	±0.03mm
2	Counterbore	φ5mm Over　/　Depth:Upto 10mm	±0.03mm
3	MAX size (Syrindarical）	φ320mm×Ｈ200mm
4	MAX size (Square）	Ｌ320mm×Ｄ320mm×Ｈ200mm

「Cutting process」

Rough cutting

	ITEM	PROCESSABLE SIZE	TOLERANCE
1	Max diameter	φ340mm
2	Thickness	2mm-420mm	±0.2mm
3	Square	L350mm×D350mm×Ｈ390mm	±0.2mm

Precision cutting

	ITEM	PROCESSABLE SIZE	TOLERANCE
1	MAX diameter	φ200mm
2	Thickness	0.6mm-5mm	±0.05mm

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「Lapping process」

	ITEM	PROCESSABLE SIZE	TOLERANCE
1	Round size	φ100mm-φ200mm　Thickness: up to 8mm	±0.02mm
2	Square size	□6.0mm-□140mm	±0.02mm

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「Cutting & Grooving for Silicon material & Quaetz」

	ITEM	PROCESSABLE SIZE (mm)	TOLERANCE
1	Cutting size	W230×D900×t50　□	±0.5mm
2	Groove size	W230×D900×t50　Groove: 1-10mm	±0.5mm

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「Coring of silicon material」

	ITEM	PROCESSABLE SIZE	TOLERANCE
1	Round size	φ210mm×L100mm	±0.5mm
2	Prism size	□210mm×L100mm	±0.5mm

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