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TEL. 03−3262-4296

2-5-10 Kudan-Minami Chiyoda-Ku Tokyo 102-0074 Japan

Products & ServiceSERVICE&PRODUCTS

「Other Process」

「Wafer Backgrinding」

Diameter: 5 inch to 12 inch
Reacheable Thickness: as thin as 200um for 5 & 6 inch, as thin as 300um for 8 & 12 inch

「Wafer Size down」

We can arrange for resizing of wafers from 12, 8, 6 inch to 4 inch etc.

「Wafer Thining」

We can arrange Wafer thining process. If you need 200um or more thin wafers, please let us know.

「Squre Process」

We can make square wafers from 6, 8, 12 inch round wafers.

「Dicing Process」

Diameter: 2 inch to 12 inch
Processable Thickness: from under 100 um
Chip size: min. approx. 0.1 um square (Rectangle shapes are also available.)
* It is possible to cut out a mixture of several sizes from a wafer.

We can also provide dicing frames, grip rings, frost carriers etc.

* We can arrange for various processes not only for silicon but also for SiC, quartz, sapphire etc.

「Laser Marking」

We can arrange Laser Marking process for your wafers.

「RCA cleaning」

We can arrange wafer cleaning process only.

「Wafer Analysis」

We can arrange wafer analysis for your wafers.

「Grinding process」

  ITEM PROCESSABLE SIZE TOLERANCE
1 Ingot diameter φ70mm-φ330mm ±0.05mm
2 Ingot length MAX 600mm
3 Flat length MAX 60mm ±2.00mm
4 Notch depth MAX 3mm ±0.25mm
5 Notch length MAX 340mm  

  ITEM PROCESSABLE SIZE TOLERANCE
1 Grinding of cylinder φ5-φ100mm×L50mm ±0.03mm
2 Polishing inside cylinder φ5-φ50mm×L50mm ±0.03mm

Remark: Surfece Ra: SD#300 Ra0.37〜0.75(μm)



「Polishing ability」

  ITEM PROCESSABLE SIZE TOLERANCE
1 MAX size L500mm×D300mm×H215mm ±0.03mm
2 MIN size L 20mm×D 20mm×H  2mm ±0.03mm

Remark: Surfece Ra: SD#300 Ra0.37〜0.75(μm) SD#500 Ra0.09〜0.17(μm)

「Hole & special shape」

  ITEM PROCESSABLE SIZE TOLERANCE
1 Hole size φ0.5mm-φ4.0mm ±0.03mm
2 Counterbore φ5mm Over / Depth:Upto 10mm ±0.03mm
3 MAX size (Syrindarical) φ320mm×H200mm  
4 MAX size (Square) L320mm×D320mm×H200mm  


「Cutting process」

Rough cutting

  ITEM PROCESSABLE SIZE TOLERANCE
1 Max diameter φ340mm  
2 Thickness 2mm-420mm ±0.2mm
3 Square L350mm×D350mm×H390mm ±0.2mm

Precision cutting

  ITEM PROCESSABLE SIZE TOLERANCE
1 MAX diameter φ200mm  
2 Thickness 0.6mm-5mm ±0.05mm

「Lapping process」

  ITEM PROCESSABLE SIZE TOLERANCE
1 Round size φ100mm-φ200mm Thickness: up to 8mm ±0.02mm
2 Square size □6.0mm-□140mm ±0.02mm

「Cutting & Grooving for Silicon material & Quaetz」

  ITEM PROCESSABLE SIZE (mm) TOLERANCE
1 Cutting size W230×D900×t50 □ ±0.5mm
2 Groove size W230×D900×t50 Groove: 1-10mm ±0.5mm

「Coring of silicon material」

  ITEM PROCESSABLE SIZE TOLERANCE
1 Round size φ210mm×L100mm ±0.5mm
2 Prism size □210mm×L100mm ±0.5mm





バナースペース

ENATEK LTD.

2-5-10 Kudan-Minami Chiyoda-Ku Tokyo 102-0074 Japan

TEL 81-3−3262-4296
FAX 81-3−3262-4048

Osaka Sales Office

3-11-26 Nishinakajima Yodogawa-ku Osaka-shi Osaka 532-0011 JAPAN

TEL 81-6-6307-5495
FAX 81-6-6307-5496